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? june 2003 1/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt high side driver n cmos compatible input n on state open load detection n off state open load detection n shorted load protection n undervoltage and overvoltage shutdown n protection against loss of ground n very low stand-by current n reverse battery protection (*) description the vn820, vn820sp, VN820-B5, vn820so, vn820pt are monolithic devices made by using stmicroelectronics vipower m0-3 technology, intended for driving any kind of load with one side connected to ground. active v cc pin voltage clamp protects the device against low energy spikes (see iso7637 transient compatibility table). active current limitation combined with thermal shutdown and automatic restart protect the device against overload. the device detects open load condition both is on and off state. output shorted to v cc is detected in the off state. device automatically turns off in case of ground pin disconnection. type r ds(on) i out v cc vn820 vn820sp VN820-B5 vn820so vn820pt 40 m w 9 a 36 v block diagram undervoltage overtemperature v cc gnd input output overvoltage current limiter logic driver power clamp status v cc clamp on state openload off state openload and output shorted to v cc detection detection detection detection detection (*) see application schematic at page 9 pentawatt p 2 pak 1 10 powerso-10 ? so-16l ppak order codes package tube t&r pentawatt vn820 - powerso-10? vn820sp vn820sp13tr p 2 pak VN820-B5 VN820-B513tr so-16l vn820so vn820so13tr ppak vn820pt vn820pt13tr
2/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt absolute maximum rating connection diagram (top view) current and voltage conventions symbol parameter value unit powerso-10 ? pentawatt p 2 pak so-16l ppak v cc dc supply voltage 41 v - v cc reverse dc supply voltage - 0.3 v - i gnd dc reverse ground pin current - 200 ma i out dc output current internally limited a - i out reverse dc output current - 9 a i in dc input current +/- 10 ma i stat dc status current +/- 10 ma v esd electrostatic discharge (human body model: r=1.5k w ; c=100pf) - input - status - output - v cc 4000 4000 5000 5000 v v v v e max maximum switching energy (l=4mh; r l =0 w ; v bat =13.5v; t jstart =150oc; i l =13a) 481 481 mj e max maximum switching energy (l=3.7mh; r l =0 w ; v bat =13.5v; t jstart =150oc; i l =13a) 438 mj e max maximum switching energy (l=4.48mh; r l =0 w ; v bat =13.5v; t jstart =150oc; i l =13a) 526 mj p tot power dissipation t c =25c 65.8 65.8 65.8 8.3 65.8 w t j junction operating temperature internally limited c t c case operating temperature - 40 to 150 c t stg storage temperature - 55 to 150 c ppak / p 2 pak / pentawatt 1 2 3 4 5 6 7 8 9 10 11 output output n.c. output output ground input status n.c. n.c. v cc powerso-10 ? v cc output output output output v cc output output v cc n.c. n.c. status input v cc gnd n.c. 1 8 9 16 so-16l input i s i in v in v cc status i stat v stat gnd v cc i out v out i gnd output
3/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt thermal data (*) when mounted on a standard single-sided fr-4 board with 0.5cm 2 of cu (at least 35 m m thick). (**) when mounted on fr4 printed circuit board with 0.5cm 2 of cu (at least 35 m thick) connected to all v cc pins. electrical characteristics (8v8v i out =3a; v cc >8v 40 80 m w m w i s supply current off state; v cc =13v; v in =v out =0v off state; v cc =13v; v in =v out =0v; t j =25 c on state; v cc =13v; v in =5v; i out =0a 10 10 2 25 20 3.5 m a m a ma i l(off1) off state output current v in =v out =0v 0 50 m a i l(off2) off state output current v in =0v; v out =3.5v -75 0 m a i l(off3) off state output current v in =v out =0v; vcc=13v; t j =125c 5 m a i l(off4) off state output current v in =v out =0v; vcc=13v; t j =25c 3 m a symbol parameter test conditions min typ max unit t d(on) turn-on delay time r l =4.3 w from v in rising edge to v out =1.3v 30 m s t d(off) turn-off delay time r l =4.3 w from v in falling edge to v out =11.7v 30 m s dv out /dt (on) turn-on voltage slope r l =4.3 w from v out =1.3 to v out =10.4v see relative diagram v/ m s dv out /dt (off) turn-off voltage slope r l =4.3 w from v out =11.7 to v out =1.3v see relative diagram v/ m s symbol parameter test conditions min typ max unit v il input low level 1.25 v i il low level input current v in =1.25v 1 m a v ih input high level 3.25 v i ih high level input current v in =3.25v 10 m a v i(hyst) input hysteresis voltage 0.5 v v icl input clamp voltage i in =1ma i in =-1ma 66.8 -0.7 8v v 1
4/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt 2 electrical characteristics (continued) status pin protections openload detection symbol parameter test conditions min typ max unit v stat status low output voltage i stat =1.6ma 0.5 v i lstat status leakage current normal operation v stat =5v 10 m a c stat status pin input capacitance normal operation v stat =5v 100 pf v scl status clamp voltage i stat =1ma i stat =-1ma 66.8 -0.7 8v v symbol parameter test conditions min typ max unit t tsd shut-down temperature 150 175 200 c t r reset temperature 135 c t hyst thermal hysteresis 7 15 c t sdl status delay in overload condition t j >t tsd 20 m s i lim current limitation 5.5v v ol t dol(on) t j > t tsd v in v stat t sdl t sdl
5/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt t t v out v in 80% 10% dv out /dt (on) t d(off) 90% dv out /dt (off) t d(on) switching time waveforms truth table conditions input output status normal operation l h l h h h current limitation l h h l x x h (t j < t tsd ) h (t j > t tsd ) l overtemperature l h l l h l undervoltage l h l l x x overvoltage l h l l h h output voltage > v ol l h h h l h output current < i ol l h l h h l
6/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt open load detection in off state off state open load detection requires an external pull-up resistor (r pu ) connected between output pin and a positive supply voltage (v pu ) like the +5v line used to supply the microprocessor. the external resistor has to be selected according to the following requirements: 1) no false open load indication when load is connected: in this case we have to avoid v out to be higher than v olmin ; this results in the following condition v out =(v pu /(r l +r pu ))r l 7/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt iso t/r 7637/1 test pulse test levels i ii iii iv delays and impedance 1 -25 v -50 v -75 v -100 v 2 ms 10 w 2 +25 v +50 v +75 v +100 v 0.2 ms 10 w 3a -25 v -50 v -100 v -150 v 0.1 m s 50 w 3b +25 v +50 v +75 v +100 v 0.1 m s 50 w 4 -4 v -5 v -6 v -7 v 100 ms, 0.01 w 5 +26.5 v +46.5 v +66.5 v +86.5 v 400 ms, 2 w iso t/r 7637/1 test pulse test levels results i ii iii iv 1cccc 2cccc 3acccc 3bcccc 4cccc 5ceee electrical transient requirements on v cc pin class contents c all functions of the device are performed as designed after exposure to disturbance. e one or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.
8/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt open load without external pull-up status input normal operation undervoltage v cc v usd v usdhyst input overvoltage v cc v cc >v ov status input status status input status input open load with external pull-up undefined figure 1: waveforms load voltage v cc v ol v ol
9/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt 1 gnd protection network against reverse battery solution 1: resistor in the ground line (r gnd only). this can be used with any type of load. the following is an indication on how to dimension the r gnd resistor. 1) r gnd 600mv / (i s(on)max ). 2) r gnd 3 (- v cc ) / (-i gnd ) where -i gnd is the dc reverse ground pin current and can be found in the absolute maximum rating section of the of the devices datasheet. power dissipation in r gnd (when v cc <0: during reverse battery situations) is: p d = (-v cc ) 2 /r gnd this resistor can be shared amongst several different hsd. please note that the value of this resistor should be calculated with formula (1) where i s(on)max becomes the sum of the maximum on-state currents of the different devices. please note that if the microprocessor ground is not common with the device ground then the r gnd will produce a shift (i s(on)max * r gnd ) in the input thresholds and the status output values. this shift will vary depending on many devices are on in the case of several high side drivers sharing the same r gnd . if the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then the st suggest to utilize solution 2 (see below). solution 2: a diode (d gnd ) in the ground line. a resistor (r gnd =1k w) should be inserted in parallel to d gnd if the device will be driving an inductive load. this small signal diode can be safely shared amongst several different hsd. also in this case, the presence of the ground network will produce a shift ( j 600mv) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. this shift will not vary if more than one hsd shares the same diode/resistor network. load dump protection d ld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds v cc max dc rating. the same applies if the device will be subject to transients on the v cc line that are greater than the ones shown in the iso t/r 7637/1 table. m c i/os protection: if a ground protection network is used and negative transient are present on the v cc line, the control pins will be pulled negative. st suggests to insert a resistor (r prot ) in line to prevent the m c i/os pins to latch-up. the value of these resistors is a compromise between the leakage current of m c and the current required by the hsd i/os (input levels compatibility) with the latch-up limit of m c i/os. -v ccpeak /i latchup r prot (v oh m c -v ih -v gnd ) / i ihmax calculation example: for v ccpeak = - 100v and i latchup 3 20ma; v oh m c 3 4.5v 5k w r prot 65k w . recommended r prot value is 10k w. 1 application schematic v cc gnd output d gnd r gnd d ld m c +5v r prot v gnd status input +5v r prot
10/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt high level input current input clamp voltage off state output current -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 iih (ua) vin=3.25v -50 -25 0 25 50 75 100 125 150 175 tc (c) 6 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 vicl (v) iin=1ma input high level -50 -25 0 25 50 75 100 125 150 175 tc (c) 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 vih (v) input hysteresis voltage input low level -50 -25 0 25 50 75 100 125 150 175 tc (c) 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 vil (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 vhyst (v) -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 il(off1) (a) off state vcc=36v vin=vout=0v
11/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt 1 overvoltage shutdown turn-on voltage slope turn-off voltage slope i lim vs t case -50 -25 0 25 50 75 100 125 150 175 tc (c) 30 32 34 36 38 40 42 44 46 48 50 vov (v) -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 100 200 300 400 500 600 700 800 900 1000 dvout/dt(on) (v/ms) vcc=13v rl=4.3ohm -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 100 200 300 400 500 600 700 800 900 1000 dvout/dt(off) (v/ms) vcc=13v rl=4.3ohm on state resistance vs t case on state resistance vs v cc -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 2.5 5 7.5 10 12.5 15 17.5 20 22.5 25 ilim (a) vcc=13v -50 -25 0 25 50 75 100 125 150 175 tc (oc) 0 10 20 30 40 50 60 70 80 90 100 ron (mohm) iout=3a vcc=8v; 13v; 36v 5 10152025303540 vcc (v) 0 10 20 30 40 50 60 70 80 90 100 ron (mohm) tc= - 40oc tc= 25oc tc= 150oc
12/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt status leakage current status low output voltage status clamp voltage -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0.01 0.02 0.03 0.04 0.05 ilstat (ua) vstat=5v -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 vstat (v) istat=1.6ma open load off state voltage detection threshold -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 vol (v) vin=0v open load on state detection threshold -50 -25 0 25 50 75 100 125 150 175 tc (oc) 80 90 100 110 120 130 140 150 160 170 180 190 200 iol (ma) vcc=13v vin=5v -50 -25 0 25 50 75 100 125 150 175 tc (c) 6 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 vscl (v) istat=1ma
13/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt powerso-10, p 2 pak, pentawatt maximum turn off current versus load inductance a = single pulse at t jstart =150oc b= repetitive pulse at t jstart =100oc c= repetitive pulse at t jstart =125oc conditions: v cc =13.5v values are generated with r l =0 w in case of repetitive pulses, t jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves b and c. v in , i l t demagnetization demagnetization demagnetization 1 10 100 0.1 1 10 100 l(mh) i lmax (a) a b c
14/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt ppak maximum turn off current versus load inductance a = single pulse at t jstart =150oc b= repetitive pulse at t jstart =100oc c= repetitive pulse at t jstart =125oc conditions: v cc =13.5v values are generated with r l =0 w in case of repetitive pulses, t jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves b and c. v in , i l t demagnetization demagnetization demagnetization 1 10 100 0.1 1 10 100 l(mh) i lmax (a) a b c
15/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt so-16l maximum turn off current versus load inductance a = single pulse at t jstart =150oc b= repetitive pulse at t jstart =100oc c= repetitive pulse at t jstart =125oc conditions: v cc =13.5v values are generated with r l =0 w in case of repetitive pulses, t jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves b and c. v in , i l t demagnetization demagnetization demagnetization 1 10 100 0.1 1 10 100 l(mh) i lmax (a) a b c
16/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt so-16l pc board r thj-amb vs pcb copper area in open box free air condition so-16l thermal data layout condition of r th and z th measurements (pcb fr4 area= 41mm x 48mm, pcb thickness=2mm, cu thickness=35 m m, copper areas: 0.5cm 2 , 6cm 2 ). 40 45 50 55 60 65 70 01234567 pcb cu heatsink area (cm^2) rth j-amb (c/w)
17/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt p 2 pak pc board r thj-amb vs pcb copper area in open box free air condition p 2 pak thermal data layout condition of r th and z th measurements (pcb fr4 area= 60mm x 60mm, pcb thickness=2mm, cu thickness=35 m m, copper areas: 0.97cm 2 , 8cm 2 ). 30 35 40 45 50 55 0246810 pcb cu heatsink area (cm^2) rthj_amb (c/w) tj-tamb=50c
18/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt ppak pc board r thj-amb vs pcb copper area in open box free air condition ppak thermal data layout condition of r th and z th measurements (pcb fr4 area= 60mm x 60mm, pcb thickness=2mm, cu thickness=35 m m, copper areas: 0.44cm 2 , 8cm 2 ). 0 10 20 30 40 50 60 70 80 90 0246810 pcb cu heatsink area (cm^2) rthj_amb (oc/w)
19/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt powerso-10 ? pc board r thj-amb vs pcb copper area in open box free air condition powerso-10 ? thermal data layout condition of r th and z th measurements (pcb fr4 area= 58mm x 58mm, pcb thickness=2mm, cu thickness=35 m m, copper areas: from minimum pad lay-out to 8cm 2 ). 30 35 40 45 50 55 0246810 pcb cu heatsink area (cm^2) rthj_amb (c/w) tj-tamb=50c
20/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt thermal fitting model of a single channel hsd in powerso-10 pulse calculation formula thermal parameter area/island (cm 2 )0.56 r1 (c/w) 0.04 r2 (c/w) 0.25 r3( c/w) 0.25 r4 (c/w) 0.8 r5 (c/w) 12 r6 (c/w) 37 22 c1 (w.s/c) 0.0008 c2 (w.s/c) 7.00e-03 c3 (w.s/c) 0.015 c4 (w.s/c) 0.3 c5 (w.s/c) 0.75 c6 (w.s/c) 3 5 z th d r th d z thtp 1 d C () + = where d t p t = powerso-10 thermal impedance junction ambient single pulse 0.01 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zth (c/ w ) 0.5 cm 2 6 cm 2 t_amb c1 r1 r2 c2 r3 c3 r4 c4 r5 c5 r6 c6 pd tj
21/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt thermal fitting model of a single channel hsd in p 2 pak pulse calculation formula thermal parameter area/island (cm 2 )0.976 r1 (c/w) 0.04 r2 (c/w) 0.25 r3( c/w) 0.3 r4 (c/w) 4 r5 (c/w) 9 r6 (c/w) 37 22 c1 (w.s/c) 0.0008 c2 (w.s/c) 0.007 c3 (w.s/c) 0.015 c4 (w.s/c) 0.4 c5 (w.s/c) 2 c6 (w.s/c) 3 5 z th d r th d z thtp 1 d C () + = where d t p t = p 2 pak thermal impedance junction ambient single pulse t_amb c1 r1 r2 c2 r3 c3 r4 c4 r5 c5 r6 c6 pd tj 0.01 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zth (c/w) 0.97 cm 2 6 cm 2
22/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt thermal fitting model of a single channel hsd in ppak pulse calculation formula thermal parameter area/island (cm 2 )0.446 r1 (c/w) 0.04 r2 (c/w) 0.25 r3( c/w) 0.3 r4 (c/w) 2 r5 (c/w) 15 r6 (c/w) 61 24 c1 (w.s/c) 0.0008 c2 (w.s/c) 0.007 c3 (w.s/c) 0.02 c4 (w.s/c) 0.3 c5 (w.s/c) 0.45 c6 (w.s/c) 0.8 5 z th d r th d z thtp 1 d C () + = where d t p t = ppak thermal impedance junction ambient single pulse t_amb c1 r1 r2 c2 r3 c3 r4 c4 r5 c5 r6 c6 pd tj 0.01 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zth (c/w) 0.44 cm 2 6 cm 2
23/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt thermal fitting model of a single channel hsd in so-16l pulse calculation formula thermal parameter area/island (cm 2 )0.56 r1 (c/w) 0.04 r2 (c/w) 0.25 r3( c/w) 2.2 r4 (c/w) 12 r5 (c/w) 15 r6 (c/w) 37 22 c1 (w.s/c) 0.0008 c2 (w.s/c) 7.00e-03 c3 (w.s/c) 1.50e-02 c4 (w.s/c) 0.14 c5 (w.s/c) 1 c6 (w.s/c) 3 5 z th d r th d z thtp 1 d C () + = where d t p t = so-16l thermal impedance junction ambient single pulse t_amb c1 r1 r2 c2 r3 c3 r4 c4 r5 c5 r6 c6 pd tj 0.01 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zt h (c /w) 0.5 cm 2 6 cm 2
24/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt 1 1 1 dim. mm. inch min. typ max. min. typ. max. a 3.35 3.65 0.132 0.144 a (*) 3.4 3.6 0.134 0.142 a1 0.00 0.10 0.000 0.004 b 0.40 0.60 0.016 0.024 b (*) 0.37 0.53 0.014 0.021 c 0.35 0.55 0.013 0.022 c (*) 0.23 0.32 0.009 0.0126 d 9.40 9.60 0.370 0.378 d1 7.40 7.60 0.291 0.300 e 9.30 9.50 0.366 0.374 e2 7.20 7.60 0.283 300 e2 (*) 7.30 7.50 0.287 0.295 e4 5.90 6.10 0.232 0.240 e4 (*) 5.90 6.30 0.232 0.248 e 1.27 0.050 f 1.25 1.35 0.049 0.053 f (*) 1.20 1.40 0.047 0.055 h 13.80 14.40 0.543 0.567 h (*) 13.85 14.35 0.545 0.565 h 0.50 0.002 l 1.20 1.80 0.047 0.070 l (*) 0.80 1.10 0.031 0.043 a 0o 8o 0o 8o a (*) 2o 8o 2o 8o 1 1 powerso-10 ? mechanical data (*) muar only poa p013p detail "a" plane seating a l a1 f a1 h a d d1 = = = = e4 0.10 a e c a b b detail "a" seating plane e2 10 1 eb he 0.25 p095a
25/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt dim. mm. inch min. typ max. min. typ. max. a 4.8 0.189 c1.370.054 d 2.4 2.8 0.094 0.110 d1 1.2 1.35 0.047 0.053 e 0.35 0.55 0.014 0.022 f 0.8 1.05 0.031 0.041 f1 1 1.4 0.039 0.055 g 3.2 3.4 3.6 0.126 0.134 0.142 g1 6.6 6.8 7 0.260 0.268 0.276 h2 10.4 0.409 h3 10.05 10.4 0.396 0.409 l 17.85 0.703 l1 15.75 0.620 l2 21.4 0.843 l3 22.5 0.886 l5 2.6 3 0.102 0.118 l6 15.1 15.8 0.594 0.622 l7 6 6.6 0.236 0.260 m4.5 0.177 m1 4 0.157 diam. 3.65 3.85 0.144 0.152 pentawatt (vertical) mechanical data
26/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt dim. mm. min. typ max. a4.30 4.80 a1 2.40 2.80 a2 0.03 0.23 b0.80 1.05 c0.45 0.60 c2 1.17 1.37 d8.95 9.35 d2 8.00 e 10.00 10.40 e1 8.50 e3.20 3.60 e1 6.60 7.00 l 13.70 14.50 l2 1.25 1.40 l3 0.90 1.70 l5 1.55 2.40 r 0.40 v2 0o 8o package weight 1.40 gr (typ) p010r p 2 pak mechanical data
27/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt dim. mm. inch min. typ max. min. typ. max. a 2.65 0.104 a1 0.1 0.2 0.004 0.008 a2 2.45 0.096 b 0.35 0.49 0.014 0.019 b1 0.23 0.32 0.009 0.012 c 0.5 0.020 c1 45 (typ.) d 10.1 10.5 0.397 0.413 e 10.0 10.65 0.393 0.419 e 1.27 0.050 e3 8.89 0.350 f 7.4 7.6 0.291 0.300 l 0.5 1.27 0.020 0.050 m 0.75 0.029 s8 (max.) so-16l mechanical data
28/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt dim. min. typ max. a 2.20 2.40 a1 0.90 1.10 a2 0.03 0.23 b 0.40 0.60 b2 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 d1 5.1 d 6.00 6.20 e 6.40 6.60 e1 4.7 e1.27 g 4.90 5.25 g1 2.38 2.70 h 9.35 10.10 l2 0.8 1.00 l4 0.60 1.00 r0.2 v2 0o 8o package weight gr. 0.3 ppak mechanical data p032t1
29/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt powerso-10 ? suggested pad layout 1 tape and reel shipment (suffix 13tr) reel dimensions all dimensions are in mm. base q.ty 600 bulk q.ty 600 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 24.4 n (min) 60 t (max) 30.4 tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 24 tape hole spacing p0 ( 0.1) 4 component spacing p 24 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 11.5 compartment depth k (max) 6.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed 6.30 10.8 - 11 14.6 - 14.9 9.5 1 2 3 4 5 1.27 0.67 - 0.73 0. 54 - 0.6 10 9 8 7 6 b a c all dimensions are in mm. base q.ty bulk q.ty tube length ( 0.5) a b c ( 0.1) casablanca 50 1000 532 10.4 16.4 0.8 muar 50 1000 532 4.9 17.2 0.8 tube shipment (no suffix) c a b muar casablanca
30/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt pentawatt tube shipment (no suffix) all dimensions are in mm. base q.ty 50 bulk q.ty 1000 tube length ( 0.5) 532 a 18 b 33.1 c ( 0.1) 1 c b a
31/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt p 2 pak tube shipment (no suffix ) all dimensions are in mm. base q.ty 50 bulk q.ty 1000 tube length ( 0.5) 532 a 18 b 33.1 c ( 0.1) 1 tape and reel shipment (suffix 13tr) all dimensions are in mm. base q.ty 1000 bulk q.ty 1000 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 24.4 n (min) 60 t (max) 30.4 tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 24 tape hole spacing p0 ( 0.1) 4 component spacing p 16 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 11.5 compartment depth k (max) 6.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions c b a
32/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt so-16l tube shipment (no suffix) 1 all dimensions are in mm. base q.ty 50 bulk q.ty 1000 tube length ( 0.5) 532 a 3.5 b 13.8 c ( 0.1) 0.6 tape and reel shipment (suffix 13tr) base q.ty 1000 bulk q.ty 1000 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 16.4 n (min) 60 t (max) 22.4 tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 16 tape hole spacing p0 ( 0.1) 4 component spacing p 12 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 7.5 compartment depth k (max) 6.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed a c b reel dimensions
33/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt ppak tube shipment (no suffix ) 1 all dimensions are in mm. base q.ty 75 bulk q.ty 3000 tube length ( 0.5) 532 a 6 b 21.3 c ( 0.1) 0.6 tape and reel shipment (suffix 13tr) all dimensions are in mm. base q.ty 2500 bulk q.ty 2500 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 16.4 n (min) 60 t (max) 22.4 tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 16 tape hole spacing p0 ( 0.1) 4 component spacing p 8 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 7.5 compartment depth k (max) 6.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions a c b
34/34 vn820 / vn820so / vn820sp / VN820-B5 / vn820pt information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this p ublication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectron ics products are not authorized for use as critical components in life support devices or systems without express written approval of stmicr oelectronics. the st logo is a trademark of stmicroelectronics ? 2003 stmicroelectronics - printed in italy- all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany - hong kong - india - israel - italy - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com

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